Hardware



Acclivis hardware capabilities are as follows:
  • Architecture definition
  • Schematic
  • Layout
  • SI Analysis
  • Thermal Analysis
  • PCB Fabrication
  • PCB Assembly
  • EDVT (Design Validation)
  • EMI / EMC pre-scan
  • Certification Testing
  • Prototype manufacturing
Project Features
  • Freescale 32-bit Microcontroller based design
  • Multiple radio on board
    • 3G Module
    • GPS Module
    • BLE & PCB antenna
  • Accelerometer, Gyroscope, various other sensors
  • Li-Ion Battery charging
  • Power optimization as Battery
  • Powered system - 4 layer, Impedance controlled, cost effective board design
  • LGA, QFN, SMD packages
  • Proto PCB size: 50 mm x 75 mm
Project Features
  • Three board System : Sensor Board + Processor Board + IO & Power supply Board
  • DMSoC From Texas Instruments
  • DDR2 & NAND memory
  • SD Card, USB 2.0
  • Video Output
  • 5MP Sensor from Aptina
  • 10 layer blind-buried, Impedance controlled board
  • 0.65mm BGA, 3.5mil x 3.5 mil routing, 215 pins/sq inch density Battery operated Device
  • Product size: 30 mm x 30 mm x 50 mm